Supersaturated solid-solution interfaces of Cu core/Ag shell structures with enhanced thermal stability and oxidation resistance

Particle size dependent Ag precipitation at different temperature and the resultant oxidation behavior of Cu-5Ag powders

(2022) Xiaojuan Gong et al.   ADVANCED POWDER TECHNOLOGY

Laser-induced shock wave sintering of silver nanoparticles on flexible substrates

(2021) Jihun Noh et al.   APPLIED SURFACE SCIENCE

Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment

(2021) Xiaojuan Gong et al.   CORROSION SCIENCE

Fabrication of fully covered Cu–Ag core–shell nanoparticles by compound method and anti-oxidation performance

(2020) Yi Huang et al.   NANOTECHNOLOGY

Intense pulsed light-induced structure-transformed ultrathin Ni shell for improving the chemical, thermal, and electrical reliability of metal nanowire electrodes without transmittance loss

(2020) Lingying Li et al.   CHEMICAL ENGINEERING JOURNAL

Room temperature sintering of Cu-Ag core-shell nanoparticles conductive inks for printed electronics

(2019) Xiaofeng Dai et al.   CHEMICAL ENGINEERING JOURNAL

High-temperature stability of copper nanoparticles through Cu@Ag nanostructures

(2019) Thomas Michaud et al.   JOURNAL OF NANOPARTICLE RESEARCH

Atomic-scale simulation of structure and mechanical properties of Cu1−xAgx|Ni multilayer systems

(2018) Adrien Gola et al.   ACTA MATERIALIA

Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

(2018) Wanli Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

(2018) Yue Gao et al.   MATERIALS & DESIGN

Synthesis of highly environmental stable copper–silver core–shell nanoparticles for direct writing flexible electronics

(2017) Shengyou Tan et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

(2017) Wanli Li et al.   Journal of Materials Chemistry C

Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air

(2016) Yanhong Tian et al.   RSC Advances

Experimental and Theoretical Studies on Oxidation of Cu-Au Alloy Surfaces: Effect of Bulk Au Concentration

(2016) Michio Okada et al.   Scientific Reports

A new method for quantitative phase analysis using X-ray powder diffraction: direct derivation of weight fractions from observed integrated intensities and chemical compositions of individual phases

(2016) Hideo Toraya   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

(2016) Jiaxiang Li et al.   Scientific Reports

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

(2015) Peng Peng et al.   ACS Applied Materials & Interfaces

Atomistic details of oxide surfaces and surface oxidation: the example of copper and its oxides

(2015) Chiara Gattinoni et al.   SURFACE SCIENCE REPORTS

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

(2014)   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Facile Preparation of Monodisperse, Impurity-Free, and Antioxidation Copper Nanoparticles on a Large Scale for Application in Conductive Ink

(2013) Yu Zhang et al.   ACS Applied Materials & Interfaces

New model for low-temperature oxidation of copper single crystal

(2013) Kensuke Fujita et al.   APPLIED SURFACE SCIENCE

Thermal stability of Cu@Ag core–shell nanoparticles

(2013) Chi-Hang Tsai et al.   CORROSION SCIENCE

Oxidation behavior of Cu–Ag core–shell particles for solar cell applications

(2013) Hoang Tri Hai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Synthesis of oxidation-resistant core–shell copper nanoparticles

(2013) Inhyuk Kim et al.   RSC Advances

Synthesis, growth mechanism and thermal stability of copper nanoparticles encapsulated by multi-layer graphene

(2012) Shiliang Wang et al.   CARBON

Strongly adhesive and flexible transparent silver nanowire conductive films fabricated with a high-intensity pulsed light technique

(2012) Jinting Jiu et al.   JOURNAL OF MATERIALS CHEMISTRY

Ag Dewetting in Cu@Ag Monodisperse Core–Shell Nanoparticles

(2012) Anya Muzikansky et al.   Journal of Physical Chemistry C

Synthesis of Oxidation-Resistant Cupronickel Nanowires for Transparent Conducting Nanowire Networks

(2012) Aaron R. Rathmell et al.   NANO LETTERS

Conductive Inks with a “Built-In” Mechanism That Enables Sintering at Room Temperature

(2011) Michael Grouchko et al.   ACS Nano

Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy

(2011) Shanshan Chen et al.   ACS Nano

Oxidation behavior of copper nanoparticles at low temperature

(2011) Akihiro Yabuki et al.   MATERIALS RESEARCH BULLETIN

Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing

(2009) Michael Grouchko et al.   JOURNAL OF MATERIALS CHEMISTRY

Study on the solid solubility extension of Mo in Cu by mechanical alloying Cu with amorphous Cr(Mo)

(2008) Shengqi Xi et al.   ACTA MATERIALIA

Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

(2008) Sunho Jeong et al.   ADVANCED FUNCTIONAL MATERIALS

Bimodal growth of the nanophases in the dual-phase composites produced by mechanical alloying in immiscible Cu–Ag system

(2008) M. Zhu et al.   JOURNAL OF MATERIALS SCIENCE

Influence of ligand structure on the stability and oxidation of copper nanoparticles

(2007) Petri Kanninen et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE