Particle size dependent Ag precipitation at different temperature and the resultant oxidation behavior of Cu-5Ag powders

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

(2021) Jianfeng Yan   Nanomaterials

Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment

(2021) Xiaojuan Gong et al.   CORROSION SCIENCE

Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration

(2020) Yiteng Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

On the competition between synchronous oxidation and preferential oxidation in Cu-Zr-Al metallic glasses

(2020) Yifei Xu et al.   CORROSION SCIENCE

Facile Preparation of Cu/Ag Core/Shell Electrospun Nanofibers as Highly Stable and Flexible Transparent Conductive Electrodes for Optoelectronic Devices

(2019) Dai-Hua Jiang et al.   ACS Applied Materials & Interfaces

Characteristics and atomization behavior of Ti-6Al-4V powder produced by plasma rotating electrode process

(2019) Junjie Tang et al.   ADVANCED POWDER TECHNOLOGY

High-temperature stability of copper nanoparticles through Cu@Ag nanostructures

(2019) Thomas Michaud et al.   JOURNAL OF NANOPARTICLE RESEARCH

Enhanced thermal stability in Cu-40 wt% Zn/WC nanocomposite

(2019) Shuaihang Pan et al.   MATERIALS & DESIGN

Effect of Cr content on microstructure and oxidation resistance of laser-clad Cu-Ni-Fe-Mo-xCr alloy coating

(2019) Yu Yang et al.   SURFACE & COATINGS TECHNOLOGY

Corrosion behaviour of CoCrMo alloy fabricated by electron beam melting

(2018) Xiaojuan Gong et al.   CORROSION SCIENCE

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

(2017) Wanli Li et al.   Journal of Materials Chemistry C

Microstructural characteristics and densification behavior of high-Nb TiAl powder produced by plasma rotating electrode process

(2017) Weiwei He et al.   MATERIALS & DESIGN

Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

(2016) Jiaxiang Li et al.   Scientific Reports

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

(2015) Peng Peng et al.   ACS Applied Materials & Interfaces

Cu-Ag core–shell nanoparticles with enhanced oxidation stability for printed electronics

(2015) Changsoo Lee et al.   NANOTECHNOLOGY

Thermal stability of Cu@Ag core–shell nanoparticles

(2013) Chi-Hang Tsai et al.   CORROSION SCIENCE

Oxidation behavior of Cu–Ag core–shell particles for solar cell applications

(2013) Hoang Tri Hai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

(2012) Bo-In Noh et al.   MICROELECTRONIC ENGINEERING

Effect of Carboxylic Acid on Sintering of Inkjet-Printed Copper Nanoparticulate Films

(2011) Kyoohee Woo et al.   ACS Applied Materials & Interfaces

Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing

(2009) Michael Grouchko et al.   JOURNAL OF MATERIALS CHEMISTRY

Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

(2008) Sunho Jeong et al.   ADVANCED FUNCTIONAL MATERIALS