Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

Research on CBN/TiC composites Part1: Effects of the cBN content and sintering process on the hardness and transverse rupture strength

(2013) Shi-Yung Chiou et al.   CERAMICS INTERNATIONAL

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

(2013) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging

(2013) Yun-Hui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Variation of temperature at the bottom surface of a hole during drilling and its effect on tool wear

(2013) Masahiko Sato et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging

(2013) Gang Chen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste

(2013) Hanguang Zheng et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Transient Thermal Impedance Measurements on Low-Temperature-Sintered Nanoscale Silver Joints

(2012) Yunhui Mei et al.   JOURNAL OF ELECTRONIC MATERIALS

Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

(2012) Xin Li et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

(2011) Gang Chen et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Low-temperature low-pressure die attach with hybrid silver particle paste

(2011) K. Suganuma et al.   MICROELECTRONICS RELIABILITY

Low temperature sintering of Ag nanoparticles for flexible electronics packaging

(2010) A. Hu et al.   APPLIED PHYSICS LETTERS

Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 $^{\circ}\hbox{C}$ and 400 $^{ \circ}\hbox{C}$ in Dry Air

(2010) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material

(2010) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Characterization of spark plasma sintered Ag nanopowders

(2010) Y Q Fu et al.   NANOTECHNOLOGY

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

(2009) T.G. Lei et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

(2009) Dun-ji Yu et al.   MATERIALS & DESIGN

Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste

(2008) Xu Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

(2008) Yusuke Akada et al.   MATERIALS TRANSACTIONS

Electrical sintering of nanoparticle structures

(2008) Mark L Allen et al.   NANOTECHNOLOGY