Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air

Facile synthesis of Cu–Ag hybrid nanowires with strong surface-enhanced Raman scattering sensitivity

(2016) Zhi Jiang et al.   CRYSTENGCOMM

Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures

(2016) Tianqi Hu et al.   MATERIALS & DESIGN

Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications

(2015) Mingyu Li et al.   ACS Applied Materials & Interfaces

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

(2015) Peng Peng et al.   ACS Applied Materials & Interfaces

Microstructure of Cu–Ag Uniform Nanoparticulate Films on Polyurethane 3D Catheters: Surface Properties

(2015) Sami Rtimi et al.   ACS Applied Materials & Interfaces

Robust Ag nanoplate ink for flexible electronics packaging

(2015) Ruo-Zhou Li et al.   Nanoscale

Electron beam induced evolution in Au, Ag, and interfaced heterogeneous Au/Ag nanoparticles

(2015) Yuzi Liu et al.   Nanoscale

Cu-Ag core–shell nanoparticles with enhanced oxidation stability for printed electronics

(2015) Changsoo Lee et al.   NANOTECHNOLOGY

Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air

(2015) Su Ding et al.   PHYSICAL CHEMISTRY CHEMICAL PHYSICS

Low Temperature Sintering Cu6Sn5Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

(2015) Ying Zhong et al.   Small

New insight into the size-controlled synthesis of silver nanoparticles and its superiority in room temperature sintering

(2014) Yao Tang et al.   CRYSTENGCOMM

Synthesis and characterization of ultra-long and pencil-like copper nanowires with a penta-twinned structure by hydrothermal method

(2014) Zhi Jiang et al.   MATERIALS LETTERS

High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

(2014) Ryota Watanabe et al.   PARTICLE & PARTICLE SYSTEMS CHARACTERIZATION

A novel method to prepare Cu@Ag core–shell nanoparticles for printed flexible electronics

(2014) Chang Kyu Kim et al.   POWDER TECHNOLOGY

Extremely flexible, printable Ag conductive features on PET and paper substrates via continuous millisecond photonic sintering in a large area

(2014) Yejin Jo et al.   Journal of Materials Chemistry C

Well-organized raspberry-like Ag@Cu bimetal nanoparticles for highly reliable and reproducible surface-enhanced Raman scattering

(2013) Jung-Pil Lee et al.   Nanoscale

Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

(2013) Shuai Wang et al.   SCRIPTA MATERIALIA

Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles

(2012) Jianfeng Yan et al.   JOURNAL OF ELECTRONIC MATERIALS

Air stable core–shell multilayer metallic nanoparticles synthesized by RAPET: fabrication, characterization and suggested applications

(2012) Evgeny Butovsky et al.   JOURNAL OF MATERIALS CHEMISTRY

A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

(2012) Toshitaka Ishizaki et al.   JOURNAL OF MATERIALS CHEMISTRY

Ag Dewetting in Cu@Ag Monodisperse Core–Shell Nanoparticles

(2012) Anya Muzikansky et al.   Journal of Physical Chemistry C

Pen-on-Paper Flexible Electronics

(2011) Analisa Russo et al.   ADVANCED MATERIALS

Preparation of PVP coated Cu NPs and the application for low-temperature bonding

(2011) Yan Jianfeng et al.   JOURNAL OF MATERIALS CHEMISTRY

Stable Aqueous Based Cu Nanoparticle Ink for Printing Well-Defined Highly Conductive Features on a Plastic Substrate

(2011) Sunho Jeong et al.   LANGMUIR

Bimetallic Ag/Au nanoparticles: A low temperature ripening strategy in aqueous solution

(2010) Yuetian Ji et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Syntheses of Ag/Cu alloy and Ag/Cu alloy core Cu shell nanoparticles using a polyol method

(2010) Masaharu Tsuji et al.   CRYSTENGCOMM

A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

(2010) Y. Morisada et al.   JOURNAL OF ELECTRONIC MATERIALS

Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties

(2010) Y. Kobayashi et al.   SOLID STATE SCIENCES

Preparation of Cu@Ag Core–Shell Nanoparticles Using a Two-step Polyol Process under Bubbling of N2Gas

(2009) Masaharu Tsuji et al.   CHEMISTRY LETTERS

Densification and grain growth during sintering of nanosized particles

(2008) Z. Z. Fang et al.   INTERNATIONAL MATERIALS REVIEWS