Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

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Title
Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 732, Issue -, Pages 240-247
Publisher
Elsevier BV
Online
2017-11-03
DOI
10.1016/j.jallcom.2017.10.193

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