Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM

Gallium-Enhanced Aluminum and Copper Electromigration Performance for Flexible Electronics

(2021) Saeedeh Ravandi et al.   ACS Applied Materials & Interfaces

Electromigration effect in Fe-Al diffusion couples with field-assisted sintering

(2020) Haoren Wang et al.   ACTA MATERIALIA

Four Dimensional (4D) Microstructural Evolution of Cu6Sn5 Intermetallic and Voids under Electromigration in Bi-crystal Pure Sn Solder Joints

(2020) Marion Branch Kelly et al.   ACTA MATERIALIA

In situ atomic scale investigation of Li7La3Zr2O12-based Li+-conducting solid electrolyte during calcination growth

(2020) Chih-Yang Huang et al.   Nano Energy

Atomic-Scale Localized Thinning and Reconstruction of Two-Dimensional WS2 Layers through In Situ Transmission Electron Microscopy/Scanning Transmission Electron Microscopy

(2020) Yi-Tang Tseng et al.   Journal of Physical Chemistry C

Observing topotactic phase transformation and resistive switching behaviors in low power SrCoOx memristor

(2020) Hung-Yang Lo et al.   Nano Energy

Atomic-scale silicidation of low resistivity Ni-Si system through in-situ TEM investigation

(2020) An-Yuan Hou et al.   APPLIED SURFACE SCIENCE

In-situ Transmission Electron Microscope Investigation of Atomic-scale Titanium Silicide Monolayer Superlattice

(2020) Hsin-Mei Lu et al.   SCRIPTA MATERIALIA

Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model

(2019) Houman Zahedmanesh et al.   JOURNAL OF APPLIED PHYSICS

Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study

(2019) Yu-chen Liu et al.   SCRIPTA MATERIALIA

Irregular bending growth of free-standing Al microwire by electromigration

(2018) Yasuhiro Kimura   ACTA MATERIALIA

Evolution and stabilization of subnanometric metal species in confined space by in situ TEM

(2018) Lichen Liu et al.   Nature Communications

Unravelling the Mechanisms of Gold–Silver Core–Shell Nanostructure Formation by in Situ TEM Using an Advanced Liquid Cell Design

(2018) Andreas Hutzler et al.   NANO LETTERS

Atomic-Scale Mechanisms of Defect-Induced Retention Failure in Ferroelectrics

(2017) Linze Li et al.   NANO LETTERS

Healing Effect of Controlled Anti-Electromigration on Conventional and High-T c Superconducting Nanowires

(2017) Xavier D. A. Baumans et al.   Small

Preferred diffusion paths for copper electromigration by in situ transmission electron microscopy

(2017) Young-Hwa Oh et al.   ULTRAMICROSCOPY

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

(2016) Yuan-Wei Chang et al.   ACTA MATERIALIA

Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

(2016) M.L. Huang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Airgaps in nano-interconnects: Mechanics and impact on electromigration

(2016) Houman Zahedmanesh et al.   JOURNAL OF APPLIED PHYSICS

Mass transport phenomena in copper nanowires at high current density

(2016) Yu-Ting Huang et al.   Nano Research

Optimization of the nanotwin-induced zigzag surface of copper by electromigration

(2016) Hsin-Ping Chen et al.   Nanoscale

In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper

(2015) Haitao Ma et al.   SCRIPTA MATERIALIA

Grain boundary complexions

(2013) Patrick R. Cantwell et al.   ACTA MATERIALIA

Defective twin boundaries in nanotwinned metals

(2013) Y. Morris Wang et al.   NATURE MATERIALS

A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn–9Zn/Cu interconnect during liquid–solid electromigration

(2013) M.L. Huang et al.   SCRIPTA MATERIALIA

Atomic mechanism and prediction of hydrogen embrittlement in iron

(2012) Jun Song et al.   NATURE MATERIALS

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

(2012) H.-Y. Hsiao et al.   SCIENCE

Characterization of Selectively Deposited Cobalt Capping Layers: Selectivity and Electromigration Resistance

(2010) C.-C Yang et al.   IEEE ELECTRON DEVICE LETTERS

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

(2009) K. Lu et al.   SCIENCE

Revealing the Maximum Strength in Nanotwinned Copper

(2009) L. Lu et al.   SCIENCE

Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

(2008) K.-C. Chen et al.   SCIENCE