In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper

Published 2015 View Full Article

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Title
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
Authors
Keywords
Electromigration, Synchrotron radiation, Inter-metallic compound, Finite volume method, Level-set variable
Journal
SCRIPTA MATERIALIA
Volume 107, Issue -, Pages 88-91
Publisher
Elsevier BV
Online
2015-05-31
DOI
10.1016/j.scriptamat.2015.05.027

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