Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study
Published 2021 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume 115, Issue 11-12, Pages 3631-3644
Publisher
Springer Science and Business Media LLC
Online
2021-06-08
DOI
10.1007/s00170-021-07391-x
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Influence of the Rake Angle on Nanocutting of Fe Single Crystals: A Molecular-Dynamics Study
- (2020) Iyad Alabd Alhafez et al. Crystals
- Rake angle effect in cutting-based single atomic layer removal
- (2020) Wenkun Xie et al. Journal of Manufacturing Processes
- Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting
- (2020) Liang Zhao et al. CERAMICS INTERNATIONAL
- Diamond tool wear mode, path and tip temperature distribution considering effect of varying rake angle and duncut/Redge ratio
- (2019) Lukman Niyi Abdulkadir et al. Surface Topography-Metrology and Properties
- Effect of tool edge radius on material removal mechanism of single-crystal silicon: Numerical and experimental study
- (2019) Bing Liu et al. COMPUTATIONAL MATERIALS SCIENCE
- Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon
- (2019) Junjie Zhang et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation
- (2019) Houfu Dai et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- A molecular dynamic study of nano-grinding of a monocrystalline copper-silicon substrate
- (2019) Yixin Xu et al. APPLIED SURFACE SCIENCE
- Modeling and simulation on the effect of tool rake angle in diamond turning of KDP crystal
- (2019) Shuo Zhang et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Numerical study of three-body diamond abrasive polishing single crystal Si under graphene lubrication by molecular dynamics simulation
- (2019) Houfu Dai et al. COMPUTATIONAL MATERIALS SCIENCE
- Prediction of cutting forces during micro end milling considering chip thickness accumulation
- (2019) S. Wojciechowski et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- A numerical study on the material removal and phase transformation in the nanometric cutting of silicon
- (2018) Jinshi Wang et al. APPLIED SURFACE SCIENCE
- Effects of recovery and side flow on surface generation in nano-cutting of single crystal silicon
- (2018) Feifei Xu et al. COMPUTATIONAL MATERIALS SCIENCE
- Experimental study on size effect of tool edge and subsurface damage of single crystal silicon in nano-cutting
- (2018) Bing Liu et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Modeling of cutting forces in micro end-milling
- (2018) Yanjie Yuan et al. Journal of Manufacturing Processes
- Effects of tool rake angle and tool nose radius on surface quality of ultraprecision diamond-turned porous silicon
- (2018) Mehdi Heidari et al. Journal of Manufacturing Processes
- Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon
- (2017) Haitao Liu et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Investigation of influence of tool rake angle in single point diamond turning of silicon
- (2017) Amir Mir et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- The study on minimum uncut chip thickness and cutting forces during laser-assisted turning of WC/NiCr clad layers
- (2017) D. Przestacki et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Anisotropy of Single-Crystal Silicon in Nanometric Cutting
- (2017) Zhiguo Wang et al. Nanoscale Research Letters
- Anisotropy of Single-Crystal Silicon in Nanometric Cutting
- (2017) Zhiguo Wang et al. Nanoscale Research Letters
- Surface texture formation in precision machining of direct laser deposited tungsten carbide
- (2017) Szymon Wojciechowski et al. Advances in Manufacturing
- Influence of microstructure on the cutting behaviour of silicon
- (2016) Saurav Goel et al. ACTA MATERIALIA
- The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation
- (2016) Houfu Dai et al. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
- An atomistic simulation investigation on chip related phenomena in nanometric cutting of single crystal silicon at elevated temperatures
- (2016) Saeed Zare Chavoshi et al. COMPUTATIONAL MATERIALS SCIENCE
- Global transition path search for dislocation formation in Ge on Si(001)
- (2016) E. Maras et al. COMPUTER PHYSICS COMMUNICATIONS
- Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon
- (2016) Xiaoguang Guo et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Molecular dynamics modelling of brittle–ductile cutting mode transition: Case study on silicon carbide
- (2015) Gaobo Xiao et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Diamond machining of silicon: A review of advances in molecular dynamics simulation
- (2015) Saurav Goel et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Ductile cutting of silicon microstructures with surface inclination measurement and compensation by using a force sensor integrated single point diamond tool
- (2015) Yuan-Liu Chen et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Molecular dynamics simulation investigation on the plastic flow behaviour of silicon during nanometric cutting
- (2015) Saeed Zare Chavoshi et al. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
- Crystallographic effect on subsurface damage formation in silicon microcutting
- (2012) Jiwang Yan et al. CIRP ANNALS-MANUFACTURING TECHNOLOGY
- Influence of temperature and crystal orientation on tool wear during single point diamond turning of silicon
- (2012) Saurav Goel et al. WEAR
- A study on phase transformation of monocrystalline silicon due to ultra-precision polishing by molecular dynamics simulation
- (2012) Lin Zhang et al. AIP Advances
- Anisotropy of machined surfaces involved in the ultra-precision turning of single-crystal silicon—a simulation and experimental study
- (2011) Minghai Wang et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool
- (2009) Alexander Stukowski MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
- Scratch-induced microplasticity and microcracking in zirconium diboride–silicon carbide composite
- (2008) Dipankar Ghosh et al. ACTA MATERIALIA
- XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
- (2008) W.J. Zong et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining
- (2008) Jiwang Yan et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreCreate your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create Now