Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon

New Deformation-Induced Nanostructure in Silicon

(2018) Bo Wang et al.   NANO LETTERS

Fabrication of ultrahigh-precision hemispherical mirrors for quantum-optics applications

(2018) Daniel B. Higginbottom et al.   Scientific Reports

Investigation of influence of tool rake angle in single point diamond turning of silicon

(2017) Amir Mir et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding

(2017) Zhenyu Zhang et al.   TRIBOLOGY LETTERS

A study on the surface quality and brittle–ductile transition during the elliptical vibration-assisted nanocutting process on monocrystalline silicon via molecular dynamic simulations

(2017) Bo Zhu et al.   RSC Advances

Interplay of dislocation-based plasticity and phase transformation during Si nanoindentation

(2016) Zhibo Zhang et al.   COMPUTATIONAL MATERIALS SCIENCE

Smooth particle hydrodynamics study of surface defect machining for diamond turning of silicon

(2016) Amir Mir et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness

(2016) Chongjun Wu et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

An experimental and theoretical investigation on the brittle ductile transition and cutting force anisotropy in cutting KDP crystal

(2016) Shengfei Wang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Changes in surface layer of silicon wafers from diamond scratching

(2015) Zhenyu Zhang et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Molecular dynamics modelling of brittle–ductile cutting mode transition: Case study on silicon carbide

(2015) Gaobo Xiao et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Ductile cutting of silicon microstructures with surface inclination measurement and compensation by using a force sensor integrated single point diamond tool

(2015) Yuan-Liu Chen et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut

(2015) Zhenyu Zhang et al.   Scientific Reports

Critical cutting thickness in ultra-precision machining of single crystal silicon

(2012) Minghai Wang et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries

(2012) Muhammad Arif et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Ductile mode material removal and high-pressure phase transformation in silicon during micro-laser assisted machining

(2012) Deepak Ravindra et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Single-point diamond turning of electroless nickel for flat X-ray mirror

(2010) Kwon Su Chon et al.   Journal of Mechanical Science and Technology

Why silicon is and will remain the dominant photovoltaic material

(2009) Rajendra Singh   Journal of Nanophotonics

Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools

(2009) Kui Liu et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B

Effects of tool edge radius on ductile machining of silicon: an investigation by FEM

(2009) Jiwang Yan et al.   SEMICONDUCTOR SCIENCE AND TECHNOLOGY

Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

(2008) Jiwang Yan et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY