Study on corrosion behavior of β-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation

Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications

(2020) So-Eun Jeong et al.   THIN SOLID FILMS

Effects of aging treatment and peripheral coarse grain on the exfoliation corrosion behaviour of 2024 aluminium alloy using SR-CT

(2020) Shuangqing Sun et al.   Journal of Materials Research and Technology-JMR&T

Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders

(2020) G. Chen et al.   MICROELECTRONICS RELIABILITY

Effect of Cathode–Anode distance and electrical resistivity on macrocell corrosion currents and cathodic response in cases of chloride induced corrosion in reinforced concrete structures

(2020) Chantal Chalhoub et al.   CONSTRUCTION AND BUILDING MATERIALS

The Structural, Elastic and Electronic Properties of Ni3−xCuxSn4 (x = 0, 0.5, 1 and 1.5) Intermetallic Compounds via Ab Initio Calculations

(2019) Wei Wei Zhang et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of rare earth Yb on microstructure and corrosion resistance of ADC12 aluminum alloy

(2019) Yongcheng Zou et al.   INTERMETALLICS

On the unusual intergranular corrosion resistance of 316L stainless steel additively manufactured by selective laser melting

(2019) Majid Laleh et al.   CORROSION SCIENCE

First-principles analysis of the inhibitive effect of interstitial carbon on an active dissolution of martensitic steel

(2019) Mariko Kadowaki et al.   CORROSION SCIENCE

Effect of prior austenite grain boundaries on corrosion fatigue behaviors of E690 high strength low alloy steel in simulated marine atmosphere

(2019) Hongchi Ma et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board

(2018) Pan Yi et al.   BIOELECTROCHEMISTRY

Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys

(2018) Raj K. Kaushik et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Characterising the polymorphic phase transformation at a localised point on a Cu 6 Sn 5 grain

(2018) Flora Somidin et al.   MATERIALS CHARACTERIZATION

Effect of grain boundary characteristic on intergranular corrosion and mechanical properties of severely sheared Al-Zn-Mg-Cu alloy

(2018) Jinghui Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers

(2018) Bokai Liao et al.   CORROSION SCIENCE

Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics

(2018) Ying Zhong et al.   ACTA MATERIALIA

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

(2018) Tzu-Ting Chou et al.   MATERIALS LETTERS

Effects of niobium and rare earth elements on microstructure and initial marine corrosion behavior of low-alloy steels

(2018) Xian Zhang et al.   APPLIED SURFACE SCIENCE

Experimental examination and thermodynamic description of the ternary Ag-Ge-Sn system

(2018) Nemanja Tošković et al.   JOURNAL OF CHEMICAL THERMODYNAMICS

Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments

(2017) Pan Yi et al.   MATERIALS RESEARCH BULLETIN

Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

(2017) Fengjiang Wang et al.   MICROELECTRONICS RELIABILITY

First-principles screening of structural properties of intermetallic compounds on martensitic transformation

(2017) Joohwi Lee et al.   npj Computational Materials

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

(2016) D.K. Mu et al.   CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE

Study of the tribocorrosion behaviors of albumin on a cobalt-based alloy using scanning Kelvin probe force microscopy and atomic force microscopy

(2016) Yu Yan et al.   ELECTROCHEMISTRY COMMUNICATIONS

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

(2016) Guang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

(2016) Z. H. Zhang et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder

(2015) Xu Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

(2015) Hongjun Ji et al.   JOURNAL OF ELECTRONIC MATERIALS

Full elastic constants of Cu 6 Sn 5 intermetallic by Resonant Ultrasound Spectroscopy (RUS) and ab initio calculations

(2015) L. Jiang et al.   SCRIPTA MATERIALIA

Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain

(2014) Chi-Pu Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

(2014) Mingna Wang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

(2014) Wen-Lin Chen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Properties and microstructures of SnAgCu– x Eu alloys for concentrator silicon solar cells solder layer

(2014) Liang Zhang et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

(2013) Shiwen Zou et al.   ELECTROCHIMICA ACTA

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing

(2013) S. J. Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

(2013) A.E. Hammad   MATERIALS & DESIGN

Microstructural development and mechanical properties of hypereutectic Sn–Cu solderalloys

(2013) José Eduardo Spinelli et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

(2012) Mingna Wang et al.   CORROSION SCIENCE

In situ investigation of unidirectional solidification in Sn–0.7Cu and Sn–0.7Cu–0.06Ni

(2011) C.M. Gourlay et al.   ACTA MATERIALIA

First-principles phonon calculations of thermodynamic properties for ductile rare-earth intermetallic compounds

(2011) Rui Wang et al.   INTERMETALLICS

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

(2011) Tae-Kyu Lee et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

(2010) Bo-In Noh et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

(2010) F.X. Che et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

(2010) Hwa-Teng Lee et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of alloying elements on properties and microstructures of SnAgCu solders

(2010) Lili Gao et al.   MICROELECTRONIC ENGINEERING

Revealing the relationship between grain size and corrosion rate of metals

(2010) K.D. Ralston et al.   SCRIPTA MATERIALIA

Potential and current distributions of one-dimensional galvanic corrosion systems

(2009) Guang-Ling Song   CORROSION SCIENCE

Localized corrosion of ultrafine-grained Al–Mg model alloys

(2009) J.G. Brunner et al.   ELECTROCHIMICA ACTA

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

(2009) K. Nogita et al.   JOM

Corrosion characterization of tin–lead and lead free solders in 3.5wt.% NaCl solution

(2007) Dezhi Li et al.   CORROSION SCIENCE

The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction

(2007) D.Q. Yu et al.   JOURNAL OF ALLOYS AND COMPOUNDS