The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

Title
The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
Authors
Keywords
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Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 507, Issue 1, Pages 215-224
Publisher
Elsevier BV
Online
2010-08-04
DOI
10.1016/j.jallcom.2010.07.160

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