Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints

Published 2014 View Full Article

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Title
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Authors
Keywords
Electromigration, lead-free solder, grain orientation effect, grain boundary misorientation effect, intermetallic compound, C4 bump
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 43, Issue 12, Pages 4386-4394
Publisher
Springer Nature
Online
2014-08-05
DOI
10.1007/s11664-014-3321-0
References
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