Low Damage Cryogenic Etching of Porous Organosilicate Low-k Materials Using SF6/O2/SiF4
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Title
Low Damage Cryogenic Etching of Porous Organosilicate Low-k Materials Using SF6/O2/SiF4
Authors
Keywords
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Journal
ECS Journal of Solid State Science and Technology
Volume 2, Issue 6, Pages N131-N139
Publisher
The Electrochemical Society
Online
2013-04-06
DOI
10.1149/2.001306jss
References
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- (2008) Salvador Eslava et al. LANGMUIR
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