Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish

Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

(2011) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(2010) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder

(2010) T. H. Chuang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

(2010) L.C. Tsao et al.   MATERIALS & DESIGN

Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder

(2009) X. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads

(2009) Yu-Yun Shiue et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder

(2009) Xiaoying Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

(2009) L.C. Tsao et al.   MATERIALS & DESIGN

Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper

(2008) J.O. Suh et al.   ACTA MATERIALIA

Interfacial intermetallic growth and shear strength of lead-free composite solder joints

(2008) S.M.L. Nai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads

(2008) J. Shen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Development of lead-free Sn–0.7Cu/Al2O3nanocomposite solders with superior strength

(2008) X L Zhong et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Research advances in nano-composite solders

(2008) J. Shen et al.   MICROELECTRONICS RELIABILITY