Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper

Published 2008 View Full Article

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Title
Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 56, Issue 5, Pages 1075-1083
Publisher
Elsevier BV
Online
2008-01-22
DOI
10.1016/j.actamat.2007.11.009

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