Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads

Published 2009 View Full Article

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Title
Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 491, Issue 1-2, Pages 610-617
Publisher
Elsevier BV
Online
2009-11-12
DOI
10.1016/j.jallcom.2009.11.017

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