MICROELECTRONICS INTERNATIONAL

Journal Title

MICROELECTRONICS INTERNATIONAL

MICROELECTRON INT

ISSN / eISSN

1356-5362

Aims and Scope

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.

Subject Area

ENGINEERING, ELECTRICAL & ELECTRONIC

MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

1.80 View Trend

CiteScore Ranking

Category	Quartile	Rank
Engineering - Electrical and Electronic Engineering	Q3	#501/738
Engineering - Surfaces, Coatings and Films	Q3	#91/131
Engineering - Condensed Matter Physics	Q3	#307/423
Engineering - Electronic, Optical and Magnetic Materials	Q3	#198/271
Engineering - Atomic and Molecular Physics, and Optics	Q3	#156/211

Web of Science Core Collection

Science Citation Index Expanded (SCIE)	Social Sciences Citation Index (SSCI)
Indexed	-

Category (Journal Citation Reports 2023)	Quartile
ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE	Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE	Q4

H-index

19

Country/Area of Publication

ENGLAND

Publisher

Emerald Group Publishing Ltd.

Publication Frequency

Tri-annual

Year Publication Started

1982

Annual Article Volume

32

Open Access

NO

Contact

EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA