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期刊名
MICROELECTRONICS INTERNATIONAL
MICROELECTRON INT
ISSN / eISSN
1356-5362
目标和范围
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.
研究方向
工程:电子与电气
材料科学:综合
CiteScore
1.80
查看趋势图
CiteScore 学科排名
类别 | 分区 | 排名 |
---|---|---|
Engineering - Electrical and Electronic Engineering | Q3 | #501/738 |
Engineering - Surfaces, Coatings and Films | Q3 | #91/131 |
Engineering - Condensed Matter Physics | Q3 | #307/423 |
Engineering - Electronic, Optical and Magnetic Materials | Q3 | #198/271 |
Engineering - Atomic and Molecular Physics, and Optics | Q3 | #156/211 |
Web of Science 核心合集
Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
---|---|
Indexed | - |
类别 (Journal Citation Reports 2023) | 分区 |
---|---|
ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q4 |
MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE | Q4 |
H-index
19
出版国家或地区
ENGLAND
出版商
Emerald Group Publishing Ltd.
出版周期
Tri-annual
出版年份
1982
年文章数
32
Open Access
NO
通讯方式
EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA
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