Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu-Cu bonding, a thermally stable joint comprising a Cu3Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 degrees C for 30s, and a shear strength equivalent to that of conventional Pb-5Sn solder could be achieved. After isothermal aging at 300 degrees C for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.