期刊
VACUUM
卷 167, 期 -, 页码 301-306出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.vacuum.2019.06.024
关键词
TLP bonding; SnBi solder; Interfacial reaction; Void formation
资金
- Postgraduate Research & Practice Innovation Program of Jiangsu Province [KYCX18-2149]
- Key project of State Key Laboratory of Advanced Welding and Joining [AWJ-19Z04]
- Funding for Outstanding Doctoral Dissertation in NUAA [BCXJ18-06]
- Postgraduate Research & Practice Innovation Prograrn of Jiangsu Province [KYCX18_0318]
- Six Talent Peaks Project in Jiangsu Province [XCL-022]
In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu UP bonding solder joints was investigated. After bonding, the prism-type Cu(6)Sn(5 )Departure process intermetallic compounds (IMCs) were formed at the interface. The growth of Cu6Sn5 IMC grains was controlled by the interface reaction flux J(2). The prism-type Cu3Sn IMCs grew at the expense of Cu6Sn5 IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced.
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