Low Temperature Sintering Cu6Sn5Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections
出版年份 2015 全文链接
标题
Low Temperature Sintering Cu6Sn5Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections
作者
关键词
-
出版物
Small
Volume 11, Issue 33, Pages 4097-4103
出版商
Wiley
发表日期
2015-06-01
DOI
10.1002/smll.201500896
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- 1D Copper Nanostructures: Progress, Challenges and Opportunities
- (2014) Sushrut Bhanushali et al. Small
- Coalescence-induced crystallisation wave in Pd nanoparticles
- (2014) Panagiotis Grammatikopoulos et al. Scientific Reports
- Intracellular Uptake and Toxicity of Ag and CuO Nanoparticles: A Comparison Between Nanoparticles and their Corresponding Metal Ions
- (2013) Pontus Cronholm et al. Small
- One-Dimensional Nano-Interconnection Formation
- (2013) Jianlong Ji et al. Small
- Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions
- (2012) M.S. Park et al. ACTA MATERIALIA
- Plasma and Microwave Flash Sintering of a Tailored Silver Nanoparticle Ink, Yielding 60% Bulk Conductivity on Cost-Effective Polymer Foils
- (2012) Jolke Perelaer et al. ADVANCED MATERIALS
- A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
- (2012) Toshitaka Ishizaki et al. JOURNAL OF MATERIALS CHEMISTRY
- Solderable and electroplatable flexible electronic circuit on a porous stretchable elastomer
- (2012) Gi Seok Jeong et al. Nature Communications
- Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering
- (2011) M.S. Park et al. ACTA MATERIALIA
- Silver Nanowires: From Scalable Synthesis to Recyclable Foldable Electronics
- (2011) Cheng Yang et al. ADVANCED MATERIALS
- Benign Joining of Ultrafine Grained Aerospace Aluminum Alloys Using Nanotechnology
- (2011) Rémi Longtin et al. ADVANCED MATERIALS
- Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test
- (2011) T.Y. Hung et al. MICROELECTRONICS RELIABILITY
- Triggering the Sintering of Silver Nanoparticles at Room Temperature
- (2010) Shlomo Magdassi et al. ACS Nano
- Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
- (2010) Chih Chen et al. Annual Review of Materials Research
- Dislocation nucleation governed softening and maximum strength in nano-twinned metals
- (2010) Xiaoyan Li et al. NATURE
- Silver nanosintering: a lead-free alternative to soldering
- (2008) Minoru Maruyama et al. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
- Densification and grain growth during sintering of nanosized particles
- (2008) Z. Z. Fang et al. INTERNATIONAL MATERIALS REVIEWS
- Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations
- (2008) Rong An et al. JOURNAL OF ELECTRONIC MATERIALS
Create your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create NowAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started