Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

标题
Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC PACKAGING
Volume 131, Issue 2, Pages 021004
出版商
ASME International
发表日期
2009-04-29
DOI
10.1115/1.3103932

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