Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu3Sn joints in electronic packaging

出版年份 2017 全文链接

标题

作者

关键词

Electronic packaging, Full Cu, 3, Sn joints, Soldering temperature, Soldering pressure, Soldering time, Interfacial microstructure evolution

出版物

Volume 58, Issue -, Pages 39-50

出版商

Elsevier BV

发表日期

2016-11-16

DOI

10.1016/j.mssp.2016.11.019

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