The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder
出版年份 2021 全文链接
标题
The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder
作者
关键词
Reactive nanophase, Alloying, Grain boundary, Transition layer, Melting properties
出版物
INTERMETALLICS
Volume 138, Issue -, Pages 107346
出版商
Elsevier BV
发表日期
2021-09-07
DOI
10.1016/j.intermet.2021.107346
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys
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