Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

Effect of γ -Fe 2 O 3 nanoparticles size on the properties of Sn-1.0Ag–0.5Cu nano-composite solders and joints

(2016) Xiuchen Zhao et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

(2016) Guang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder

(2015) Yong Wang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Creep behavior of SnAgCu solders containing nano-Al particles

(2015) Liang Zhang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

(2015) Srivalli Chellvarajoo et al.   MATERIALS & DESIGN

Effect of ageing time on the tensile behavior of Sn–3.5wt% Ag–0.5wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles

(2015) M. Sobhy et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

(2015) Ai Ting Tan et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

Structure and properties of lead-free solders bearing micro and nano particles

(2014) Liang Zhang et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

A review: On the development of low melting temperature Pb-free solders

(2014) Hiren R. Kotadia et al.   MICROELECTRONICS RELIABILITY

Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

(2013) L.C. Tsao et al.   MATERIALS & DESIGN

Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

(2013) Y. Tang et al.   MATERIALS & DESIGN

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

(2012) S.L. Tay et al.   INTERMETALLICS

Formation of intermetallic reaction layer and joining strength in nano-composite solder joint

(2012) A. Roshanghias et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

(2011) A.S.M.A. Haseeb et al.   INTERMETALLICS

Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

(2011) J. C. Leong et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate

(2011) L.C. Tsao   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(2010) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

(2010) Asit Kumar Gain et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder

(2010) T. H. Chuang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS