Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

标题
Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 509, Issue 5, Pages 2326-2333
出版商
Elsevier BV
发表日期
2010-11-12
DOI
10.1016/j.jallcom.2010.11.010

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