标题
A review: influence of nano particles reinforced on solder alloy
作者
关键词
-
出版物
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 25, Issue 4, Pages 229-241
出版商
Emerald
发表日期
2013-08-08
DOI
10.1108/ssmt-11-2012-0026
参考文献
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- (2012) L.C. Tsao et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing
- (2011) A.S.M.A. Haseeb et al. INTERMETALLICS
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- (2011) S.Y. Chang et al. MATERIALS & DESIGN
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- (2011) A.S.M.A. Haseeb et al. MATERIALS CHARACTERIZATION
- Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature
- (2011) K.N. Prabhu et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder
- (2011) John P. Koppes et al. Materials Science and Engineering B-Advanced Functional Solid-State Materials
- Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
- (2011) Asit Kumar Gain et al. MICROELECTRONICS RELIABILITY
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- (2010) C.Y. Lin et al. JOURNAL OF ALLOYS AND COMPOUNDS
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- (2010) A.A. El-Daly et al. JOURNAL OF ALLOYS AND COMPOUNDS
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- (2010) R.M. Shalaby JOURNAL OF ALLOYS AND COMPOUNDS
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- (2010) Changdong Zou et al. MATERIALS CHARACTERIZATION
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- (2010) Leonardo R. Garcia et al. MATERIALS CHARACTERIZATION
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- (2010) H. Tsukamoto et al. Materials Science and Engineering B-Advanced Functional Solid-State Materials
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- (2010) Lili Gao et al. MICROELECTRONIC ENGINEERING
- Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy
- (2010) Mansur Ahmed et al. MICROELECTRONICS RELIABILITY
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- (2009) Ramani Mayappan et al. INTERMETALLICS
- Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy
- (2009) Kannachai Kanlayasiri et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
- (2009) Yulai Gao et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys
- (2009) A.A. El-Daly et al. JOURNAL OF ALLOYS AND COMPOUNDS
- A review of mechanical properties of lead-free solders for electronic packaging
- (2009) Hongtao Ma et al. JOURNAL OF MATERIALS SCIENCE
- Development of Sn–Zn lead-free solders bearing alloying elements
- (2009) Liang Zhang et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Synthesis and characterization of Sn–3.5Ag–XZn alloy nanoparticles by the chemical reduction method
- (2008) C.Y. Lin et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads
- (2008) J. Shen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Comparison of different methods to measure contact angles of soil colloids
- (2008) Jianying Shang et al. JOURNAL OF COLLOID AND INTERFACE SCIENCE
- Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test
- (2008) Seong-jae Jeon et al. MICROELECTRONIC ENGINEERING
- Research advances in nano-composite solders
- (2008) J. Shen et al. MICROELECTRONICS RELIABILITY
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- (2007) Ching-Tsung Lin et al. JOURNAL OF ALLOYS AND COMPOUNDS
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