Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
出版年份 2016 全文链接
标题
Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
作者
关键词
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出版物
Materials
Volume 9, Issue 7, Pages 522
出版商
MDPI AG
发表日期
2016-06-29
DOI
10.3390/ma9070522
参考文献
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注意:仅列出部分参考文献,下载原文获取全部文献信息。- Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method
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