Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy

标题
Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
作者
关键词
-
出版物
MATERIALS & DESIGN
Volume 55, Issue -, Pages 837-845
出版商
Elsevier BV
发表日期
2013-11-06
DOI
10.1016/j.matdes.2013.10.043

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