The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder
Published 2021 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder
Authors
Keywords
Reactive nanophase, Alloying, Grain boundary, Transition layer, Melting properties
Journal
INTERMETALLICS
Volume 138, Issue -, Pages 107346
Publisher
Elsevier BV
Online
2021-09-07
DOI
10.1016/j.intermet.2021.107346
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys
- (2018) Xiaowu Hu et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
- (2018) F.Q. Hu et al. MATERIALS LETTERS
- Enhancing creep resistance of SnBi solder alloy with non-reactive nano fillers: A study using nanoindentation
- (2017) Lu Shen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles
- (2017) A. Yakymovych et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
- (2016) A. Yakymovych et al. JOURNAL OF ELECTRONIC MATERIALS
- Elastic moduli of nanocrystalline binary Al alloys with Fe, Co, Ti, Mg and Pb alloying elements
- (2016) Rita I. Babicheva et al. PHILOSOPHICAL MAGAZINE
- Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
- (2016) Yee Leong et al. Materials
- Effect of grain boundary segregations of Fe, Co, Cu, Ti, Mg and Pb on small plastic deformation of nanocrystalline Al
- (2015) Rita I. Babicheva et al. COMPUTATIONAL MATERIALS SCIENCE
- Influence of cerium addition on microstructure and properties of Sn–Cu–(Ag) solder alloys
- (2015) Marian Drienovsky et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
- (2013) A.A. El-Daly et al. MATERIALS & DESIGN
- A review: influence of nano particles reinforced on solder alloy
- (2013) Ervina Efzan Mhd Noor et al. SOLDERING & SURFACE MOUNT TECHNOLOGY
- Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
- (2012) L.C. Tsao et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers
- (2012) Lu Shen et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing
- (2011) J.H. Ke et al. ACTA MATERIALIA
- Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
- (2011) Asit Kumar Gain et al. MICROELECTRONICS RELIABILITY
- Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
- (2010) L.C. Tsao JOURNAL OF ALLOYS AND COMPOUNDS
- Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
- (2010) L.C. Tsao et al. MATERIALS & DESIGN
- Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder
- (2009) Ramani Mayappan et al. INTERMETALLICS
- Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder
- (2009) L.C. Tsao et al. MATERIALS & DESIGN
- Interfacial intermetallic growth and shear strength of lead-free composite solder joints
- (2008) S.M.L. Nai et al. JOURNAL OF ALLOYS AND COMPOUNDS
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreAdd your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload Now