High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics

A review on advanced carbon-based thermal interface materials for electronic devices

(2020) Junaid Khan et al.   CARBON

A review of thermal interface material fabrication method toward enhancing heat dissipation

(2020) Raihana Bahru et al.   INTERNATIONAL JOURNAL OF ENERGY RESEARCH

Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review

(2020) Haoqi Ma et al.   Journal of Materials Science

Co-designing electronics with microfluidics for more sustainable cooling

(2020) Remco van Erp et al.   NATURE

High performance liquid metal thermal interface materials

(2020) Sen Chen et al.   NANOTECHNOLOGY

Oxide‐Mediated Formation of Chemically Stable Tungsten–Liquid Metal Mixtures for Enhanced Thermal Interfaces

(2019) Wilson Kong et al.   ADVANCED MATERIALS

A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications

(2019) M. C. Kumar Swamy et al.   JOURNAL OF ELECTRONIC MATERIALS

High thermal conductivity liquid metal pad for heat dissipation in electronic devices

(2018) Zuoye Lin et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

(2018) Zhilin Tian et al.   Journal of Materials Chemistry A

Novel nanostructured thermal interface materials: a review

(2017) Josef Hansson et al.   INTERNATIONAL MATERIALS REVIEWS

Present and future thermal interface materials for electronic devices

(2017) Kafil M. Razeeb et al.   INTERNATIONAL MATERIALS REVIEWS

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

(2017) Ping Zhang et al.   MACROMOLECULAR MATERIALS AND ENGINEERING

A critical review of traditional and emerging techniques and fluids for electronics cooling

(2017) S.M. Sohel Murshed et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

(2016) Daewoo Suh et al.   ADVANCED MATERIALS

Super-elastic graphene/carbon nanotube aerogel: A novel thermal interface material with highly thermal transport properties

(2016) Peng Lv et al.   CARBON

The chips are down for Moore’s law

(2016) M. Mitchell Waldrop   NATURE

Application of TCE-PCM based heat sinks for cooling of electronic components: A review

(2016) Santosh Kumar Sahoo et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Investigation into the application of low melting temperature alloys as wet thermal interface materials

(2015) Chandan K. Roy et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Application of graphene as filler to improve thermal transport property of epoxy resin for thermal interface materials

(2015) Bo Tang et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil

(2014) Shengfu Mei et al.   JOURNAL OF ELECTRONIC PACKAGING

Gallium-based thermal interface material with high compliance and wettability

(2012) Yunxia Gao et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Characterization of a liquid–metal microdroplet thermal interface material

(2011) A. Hamdan et al.   EXPERIMENTAL THERMAL AND FLUID SCIENCE

Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device

(2009) Yue-Guang Deng et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING