Application of TCE-PCM based heat sinks for cooling of electronic components: A review

出版年份 2016 全文链接

标题

作者

关键词

Phase change material, Thermal conductivity enhancer, Fins, Nano particles, Metallic foams

出版物

Volume 59, Issue -, Pages 550-582

出版商

Elsevier BV

发表日期

2016-01-22

DOI

10.1016/j.rser.2015.12.238

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