High thermal conductivity liquid metal pad for heat dissipation in electronic devices
出版年份 2018 全文链接
标题
High thermal conductivity liquid metal pad for heat dissipation in electronic devices
作者
关键词
-
出版物
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 124, Issue 5, Pages -
出版商
Springer Nature
发表日期
2018-04-13
DOI
10.1007/s00339-018-1778-z
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Fabrication of axial p-n junction silicon nanopillar devices and application in photovoltaics
- (2017) Athanasios Smyrnakis et al. MICROELECTRONIC ENGINEERING
- An Integrated Liquid Cooling System Based on Galinstan Liquid Metal Droplets
- (2016) Jiu Yang Zhu et al. ACS Applied Materials & Interfaces
- Experimental and numerical study on phase change material (PCM) for thermal management of mobile devices
- (2016) Yusuke Tomizawa et al. APPLIED THERMAL ENGINEERING
- Super-elastic graphene/carbon nanotube aerogel: A novel thermal interface material with highly thermal transport properties
- (2016) Peng Lv et al. CARBON
- Density, surface tension and viscosity of liquid binary Al-Zn and ternary Al-Li-Zn alloys
- (2016) M.E. Trybula et al. FLUID PHASE EQUILIBRIA
- Techniques for Reducing Thermal Contact Resistance in Steady-State Thermal Conductivity Measurements on Polymer Composites
- (2016) C. Stacey et al. INTERNATIONAL JOURNAL OF THERMOPHYSICS
- Onsite synthesis of thermally percolated nanocomposite for thermal interface material
- (2016) Masanao Obori et al. JOURNAL OF APPLIED PHYSICS
- Thermal Performance of Liquid Metal Alloy with Graphene Addition as Thermal Interface Material
- (2016) Gen Li et al. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
- Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
- (2016) Bismarck L. Silva et al. MATERIALS CHARACTERIZATION
- Liquid metal actuation by electrical control of interfacial tension
- (2016) Collin B. Eaker et al. Applied Physics Reviews
- RETRACTED: Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package
- (2015) Jing Wang et al. ENERGY CONVERSION AND MANAGEMENT
- High-Performance Thermal Interface Material Based on Few-Layer Graphene Composite
- (2015) Wonjun Park et al. Journal of Physical Chemistry C
- Transfer printing of fully formed thin-film microscale GaAs lasers on silicon with a thermally conductive interface material
- (2015) Xing Sheng et al. Laser & Photonics Reviews
- Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials
- (2015) Chandan K. Roy et al. MICROELECTRONICS RELIABILITY
- Design Considerations for Unconventional Electrochemical Energy Storage Architectures
- (2015) Alexandru Vlad et al. Advanced Energy Materials
- Infrared thermography (IRT) applications for building diagnostics: A review
- (2014) Angeliki Kylili et al. APPLIED ENERGY
- Thermal boundary conductance across metal-gallium nitride interfaces from 80 to 450 K
- (2014) Brian F. Donovan et al. APPLIED PHYSICS LETTERS
- Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications
- (2014) J. Liu et al. JOURNAL OF MATERIALS SCIENCE
- Emerging challenges and materials for thermal management of electronics
- (2014) Arden L. Moore et al. Materials Today
- Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material
- (2014) P. Anithambigai et al. MICROELECTRONICS JOURNAL
- Plasmon-induced hot-electron generation at nanoparticle/metal-oxide interfaces for photovoltaic and photocatalytic devices
- (2014) César Clavero Nature Photonics
- Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation
- (2013) Ziyin Lin et al. COMPOSITES SCIENCE AND TECHNOLOGY
- A Liquid-Metal Monopole Array With Tunable Frequency, Gain, and Beam Steering
- (2013) Andy M. Morishita et al. IEEE Antennas and Wireless Propagation Letters
- Influence of AlN Thin Film as Thermal Interface Material on Thermal and Optical Properties of High-Power LED
- (2013) Shanmugan Subramani et al. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
- Dynamic behavior of surface charge on direct- fluorinated polyimide films
- (2013) B. X. Du et al. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
- Thermal and mechanical properties of hemp fabric-reinforced nanoclay–cement nanocomposites
- (2013) A. Hakamy et al. JOURNAL OF MATERIALS SCIENCE
- Development and Validation of a Smartphone Addiction Scale (SAS)
- (2013) Min Kwon et al. PLoS One
- Low melting point liquid metal as a new class of phase change material: An emerging frontier in energy area
- (2013) Haoshan Ge et al. RENEWABLE & SUSTAINABLE ENERGY REVIEWS
- Improved heat dissipation in gallium nitride light-emitting diodes with embedded graphene oxide pattern
- (2013) Nam Han et al. Nature Communications
- Reliability of thermal interface materials: A review
- (2012) Jens Due et al. APPLIED THERMAL ENGINEERING
- A liquid metal cooling system for the thermal management of high power LEDs
- (2010) Yueguang Deng et al. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER
- Doping Effect of La and Dy on the Thermoelectric Properties of SrTiO3
- (2010) Hong Chao Wang et al. JOURNAL OF THE AMERICAN CERAMIC SOCIETY
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started