A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications
出版年份 2019 全文链接
标题
A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications
作者
关键词
Thermal interface material, thermal resistance, thermal contact, thermal conductivity, low-melting alloys
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2019-09-18
DOI
10.1007/s11664-019-07623-7
参考文献
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