High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics
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Title
High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics
Authors
Keywords
Soft-metal, Thermal pad, Thermal interface material, Electronics cooling
Journal
APPLIED THERMAL ENGINEERING
Volume 199, Issue -, Pages 117555
Publisher
Elsevier BV
Online
2021-09-12
DOI
10.1016/j.applthermaleng.2021.117555
References
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