标题
Co-designing electronics with microfluidics for more sustainable cooling
作者
关键词
-
出版物
NATURE
Volume 585, Issue 7824, Pages 211-216
出版商
Springer Science and Business Media LLC
发表日期
2020-09-10
DOI
10.1038/s41586-020-2666-1
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices
- (2019) Tiwei Wei et al. IEEE TRANSACTIONS ON POWER ELECTRONICS
- Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling
- (2019) Doosan Back et al. IEEE Transactions on Components Packaging and Manufacturing Technology
- Fast-Switching Tri-Anode Schottky Barrier Diodes for Monolithically Integrated GaN-on-Si Power Circuits
- (2019) Luca Nela et al. IEEE ELECTRON DEVICE LETTERS
- High performance AlGaN/GaN pressure sensor with a Wheatstone bridge circuit
- (2019) Xin Tan et al. MICROELECTRONIC ENGINEERING
- A single phase hybrid micro heat sink using impinging micro-jet arrays and microchannels
- (2018) A.J. Robinson et al. APPLIED THERMAL ENGINEERING
- A “2.5-D” modeling approach for single-phase flow and heat transfer in manifold microchannels
- (2018) Raphael Mandel et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
- (2018) Kevin P. Drummond et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- The 2018 GaN power electronics roadmap
- (2018) H Amano et al. JOURNAL OF PHYSICS D-APPLIED PHYSICS
- How to stop data centres from gobbling up the world’s electricity
- (2018) Nicola Jones NATURE
- Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
- (2018) Ki Wook Jung et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- InAlN/GaN high electron mobility micro-pressure sensors for high-temperature environments
- (2017) Caitlin A. Chapin et al. SENSORS AND ACTUATORS A-PHYSICAL
- Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling
- (2017) Yong Han et al. IEEE Transactions on Components Packaging and Manufacturing Technology
- Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
- (2016) Gerd Schlottig et al. JOURNAL OF ELECTRONIC PACKAGING
- Energy efficient hotspot-targeted embedded liquid cooling of electronics
- (2015) Chander Shekhar Sharma et al. APPLIED ENERGY
- AlGaN/GaN diaphragm-based pressure sensor with direct high performance piezoelectric transduction mechanism
- (2015) J. Dzuba et al. APPLIED PHYSICS LETTERS
- KOH based selective wet chemical etching of AlN, AlxGa1−xN, and GaN crystals: A way towards substrate removal in deep ultraviolet-light emitting diode
- (2015) W. Guo et al. APPLIED PHYSICS LETTERS
- Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
- (2014) Yong Han et al. IEEE Transactions on Components Packaging and Manufacturing Technology
- Fine-resolution two-phase flow heat transfer coefficient measurements of refrigerants in multi-microchannel evaporators
- (2013) Sylwia Szczukiewicz et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Manifold microchannel heat sink design using optimization under uncertainty
- (2013) Suchismita Sarangi et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Toward Dark Silicon in Servers
- (2011) Nikos Hardavellas et al. IEEE MICRO
- Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
- (2010) W. Escher et al. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
- Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies
- (2009) Sidy Ndao et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Thermal Challenges in Next-Generation Electronic Systems
- (2008) Suresh V. Garimella et al. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
- Interlayer cooling potential in vertically integrated packages
- (2008) T. Brunschwiler et al. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started