Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy

Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution

(2020) Chen Xiao et al.   TRIBOLOGY INTERNATIONAL

Study on the polishing mechanism of pH-dependent tribochemical removal in CMP of CaF2 crystal

(2020) Jie Guo et al.   TRIBOLOGY INTERNATIONAL

Surface Structure Dependence of Mechanochemical Etching: Scanning Probe-Based Nanolithography Study on Si(100), Si(110), and Si(111)

(2019) Chen Xiao et al.   ACS Applied Materials & Interfaces

Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing

(2019) Lin Wang et al.   TRIBOLOGY INTERNATIONAL

Effect of abrasive particle size on tribochemical wear of monocrystalline silicon

(2017) Peng Zhang et al.   TRIBOLOGY INTERNATIONAL

Role of the oxidation state of cerium on the ceria surfaces for silicate adsorption

(2016) Jihoon Seo et al.   APPLIED SURFACE SCIENCE

Physical and chemical mechanisms affecting electrical conductivity in reduced graphene oxide films

(2016) Velram Balaji Mohan et al.   THIN SOLID FILMS

A material removal model for silicon oxide layers in chemical mechanical planarization considering the promoted chemical reaction by the down pressure

(2016) Yongguang Wang et al.   TRIBOLOGY INTERNATIONAL

Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

(2015) Yan Zhou et al.   TRIBOLOGY INTERNATIONAL

Use of anionic surfactants for selective polishing of silicon dioxide over silicon nitride films using colloidal silica-based slurries

(2013) Naresh K. Penta et al.   APPLIED SURFACE SCIENCE

Role of hydrogen bonding on the adsorption of several amino acids on SiO2 and Si3N4 and selective polishing of these materials using ceria dispersions

(2013) Naresh K. Penta et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Abrasive and additive interactions in high selectivity STI CMP slurries

(2013) B.V.S. Praveen et al.   MICROELECTRONIC ENGINEERING

The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide

(2013) Tae-Young Kwon et al.   TRIBOLOGY INTERNATIONAL

Investigation of mechanical and tribological properties of bone cement by nano-indentation and nano-scratch experiments

(2012) A. Karimzadeh et al.   POLYMER TESTING

Selective layer chemical mechanical planarization process mimicked with atomic force microscope

(2011) F Ilie et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY

Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions

(2010) P. R. Veera Dandu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries

(2009) P. R. Dandu Veera et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Aspects of scanning force microscope probes and their effects on dimensional measurement

(2008) Andrew Yacoot et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Atomistic Wear in a Single Asperity Sliding Contact

(2008) Bernd Gotsmann et al.   PHYSICAL REVIEW LETTERS