The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide

标题
The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide
作者
关键词
-
出版物
TRIBOLOGY INTERNATIONAL
Volume 67, Issue -, Pages 272-277
出版商
Elsevier BV
发表日期
2013-08-23
DOI
10.1016/j.triboint.2013.08.008

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