A material removal model for silicon oxide layers in chemical mechanical planarization considering the promoted chemical reaction by the down pressure

出版年份 2016 全文链接

标题

作者

关键词

CMP, Model, Promoted reaction, Chemical mechanical synergy

出版物

TRIBOLOGY INTERNATIONAL

Volume 93, Issue -, Pages 11-16

出版商

Elsevier BV

发表日期

2015-09-13

DOI

10.1016/j.triboint.2015.09.008

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