Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

出版年份 2018 全文链接

标题

Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

作者

关键词

-

出版物

MICROELECTRONICS RELIABILITY

Volume 87, Issue -, Pages 75-80

出版商

Elsevier BV

发表日期

2018-06-12

DOI

10.1016/j.microrel.2018.05.017

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