Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Ultrarapid formation of multi-phase reinforced joints of hypereutectic Al-Si alloys via an ultrasound-induced liquid phase method using Sn-51In interlayer

(2018) Lin Zhu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Ultrasound-Assisted Transient Liquid Phase Bonding of Magnesium Alloy Using Brass Interlayer in Air

(2017) Zhiwei Lai et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Non-interfacial growth of Cu 3 Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

(2017) H.Y. Zhao et al.   MATERIALS LETTERS

Rapid ultrasound-induced transient-liquid-phase bonding of Al-50Si alloys with Zn interlayer in air for electrical packaging application

(2017) Qian Wang et al.   ULTRASONICS SONOCHEMISTRY

Ultrasonic-promoted rapid TLP bonding of fine-grained 7034 high strength aluminum alloys

(2017) Weibing Guo et al.   ULTRASONICS SONOCHEMISTRY

Joining Mg alloys with Zn interlayer by novel ultrasonic-assisted transient liquid phase bonding method in air

(2016) Zhiwei Lai et al.   MATERIALS LETTERS

Si particulate-reinforced ZnAl based composites joints of hypereutectic Al50Si alloys by ultrasonic-assisted soldering

(2016) Qian Wang et al.   MATERIALS & DESIGN

Ultrasonic-assisted brazing of Al–Ti dissimilar alloy by a filler metal with a large semi-solid temperature range

(2016) Xiaoguang Chen et al.   MATERIALS & DESIGN

Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures

(2011) X. Cheng et al.   COMPUTATIONAL MATERIALS SCIENCE

Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics

(2011) R. Koleňák et al.   MATERIALS & DESIGN

Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Quasi-Melting Zn-Sn Alloy

(2010) Toru Nagaoka et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model

(2009) Rui Wu Chang et al.   JOURNAL OF ELECTRONIC MATERIALS

Ultrasonic welding between mild steel sheet and Al–Mg alloy sheet

(2009) Takehiko Watanabe et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY