Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints

标题
Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 506, Issue 1, Pages 331-337
出版商
Elsevier BV
发表日期
2010-07-14
DOI
10.1016/j.jallcom.2010.06.202

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