Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

标题
Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 487, Issue 1-2, Pages 682-686
出版商
Elsevier BV
发表日期
2009-08-19
DOI
10.1016/j.jallcom.2009.08.035

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now