Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Carbon nanotube vertical interconnects fabricated at temperatures as low as 350°C

(2014) S. Vollebregt et al.   CARBON

Localized synthesis of horizontally suspended carbon nanotubes

(2013) Jingyu Lu et al.   CARBON

Carbon nanotubes horizontal interconnects with end-bonded contacts, diameters down to 50nm and lengths up to 20μm

(2013) N. Chiodarelli et al.   CARBON

Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications—Part I: Process Development

(2013) Hong Li et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

(2012) Teng Wang et al.   IEEE ELECTRON DEVICE LETTERS

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

(2012) Hae-A-Seul Shin et al.   JOURNAL OF ELECTRONIC MATERIALS

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

(2012) Di Jiang et al.   MICROELECTRONIC ENGINEERING

The effects of catalyst treatment on fast growth of millimeter-long multi-walled carbon nanotube arrays

(2011) Zhao-Yao Zhan et al.   APPLIED SURFACE SCIENCE

Fabrication, microstructure, and mechanical properties of tin nanostructures

(2011) Michael J. Burek et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

(2011) A.S. Budiman et al.   MICROELECTRONICS RELIABILITY

Photoresponse of multi-walled carbon nanotube–copper sulfide (MWNT–CuS) hybrid nanostructures

(2011) Zhaoyao Zhan et al.   PHYSICAL CHEMISTRY CHEMICAL PHYSICS

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

(2011) Teng Wang et al.   Small

3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias

(2011) Yann Civale et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Ultrafast Transfer of Metal-Enhanced Carbon Nanotubes at Low Temperature for Large-Scale Electronics Assembly

(2010) Yifeng Fu et al.   ADVANCED MATERIALS

Contact resistance between metal and carbon nanotube interconnects: Effect of work function and wettability

(2010) Seong Chu Lim et al.   APPLIED PHYSICS LETTERS

Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

(2010) Chuan Xu et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

(2010) A.S. Budiman et al.   JOURNAL OF ELECTRONIC MATERIALS

Growth and structural characterization of epitaxial Cu/Nb multilayers

(2010) A.S. Budiman et al.   THIN SOLID FILMS

Through silicon vias filled with planarized carbon nanotube bundles

(2009) Teng Wang et al.   NANOTECHNOLOGY

Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction

(2008) Kai Chen et al.   JOURNAL OF APPLIED PHYSICS

A Paradigm of Carbon Nanotube Interconnects in Microelectronic Packaging

(2008) Yangyang Sun et al.   JOURNAL OF ELECTRONIC MATERIALS

Controlled growth and electrical characterization of bent single-walled carbon nanotubes

(2008) Jun Huang et al.   NANOTECHNOLOGY