Atom insertion into grain boundaries and stress generation in physically vapor deposited films

Postcoalescence Evolution of Growth Stress in Polycrystalline Films

(2013) A. González-González et al.   PHYSICAL REVIEW LETTERS

Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure

(2012) E. Chason et al.   JOURNAL OF APPLIED PHYSICS

Effect of adatom surface diffusivity on microstructure and intrinsic stress evolutions during Ag film growth

(2012) D. Flötotto et al.   JOURNAL OF APPLIED PHYSICS

Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques

(2012) L. E. Koutsokeras et al.   JOURNAL OF APPLIED PHYSICS

A kinetic analysis of residual stress evolution in polycrystalline thin films

(2012) Eric Chason   THIN SOLID FILMS

Temporal Evolution of the Ion Fluxes for Various Elements in HIPIMS Plasma Discharge

(2011) Ante Hecimovic et al.   IEEE TRANSACTIONS ON PLASMA SCIENCE

The origin of stresses in magnetron-sputtered thin films with zone T structures

(2010) R. Daniel et al.   ACTA MATERIALIA

Atomistic simulations of stress and microstructure evolution during polycrystalline Ni film growth

(2009) Chun-Wei Pao et al.   PHYSICAL REVIEW B

Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films

(2009) J. Leib et al.   PHYSICAL REVIEW LETTERS

Stress in Evaporated and Sputtered Thin Films – A Comparison

(2009) R. Koch   SURFACE & COATINGS TECHNOLOGY

High power pulsed magnetron sputtering: A review on scientific and engineering state of the art

(2009) K. Sarakinos et al.   SURFACE & COATINGS TECHNOLOGY

The metal flux from a rotating cylindrical magnetron: a Monte Carlo simulation

(2008) K Van Aeken et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS