Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques

Title
Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques
Authors
Keywords
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Journal
JOURNAL OF APPLIED PHYSICS
Volume 111, Issue 9, Pages 093509
Publisher
AIP Publishing
Online
2012-05-04
DOI
10.1063/1.4710530

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