Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems
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Title
Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems
Authors
Keywords
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Journal
Advanced Electronic Materials
Volume 4, Issue 4, Pages 1700277
Publisher
Wiley
Online
2018-03-01
DOI
10.1002/aelm.201700277
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