Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems

Title
Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems
Authors
Keywords
-
Journal
Advanced Electronic Materials
Volume 4, Issue 4, Pages 1700277
Publisher
Wiley
Online
2018-03-01
DOI
10.1002/aelm.201700277

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