A New Fabrication and Assembly Process for Ultrathin Chips

Published 2009 View Full Article

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Title
A New Fabrication and Assembly Process for Ultrathin Chips
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 56, Issue 2, Pages 321-327
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-01-21
DOI
10.1109/ted.2009.2010581

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