Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems
出版年份 2018 全文链接
标题
Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems
作者
关键词
-
出版物
Advanced Electronic Materials
Volume 4, Issue 4, Pages 1700277
出版商
Wiley
发表日期
2018-03-01
DOI
10.1002/aelm.201700277
参考文献
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