Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation

Atomistic simulation study of tensile deformation in nanocrystalline and single-crystal Au

(2017) Cheng-Da Wu et al.   JOURNAL OF MOLECULAR MODELING

Deformation and failure mechanisms of electrochemically lithiated silicon thin films

(2017) Hansinee Sitinamaluwa et al.   RSC Advances

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

(2017) Liping He et al.   AIP Advances

The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation

(2016) Houfu Dai et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

A molecular dynamics investigation into plastic deformation mechanism of nanocrystalline copper for different nanoscratching rates

(2016) Jia Li et al.   COMPUTATIONAL MATERIALS SCIENCE

Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

(2016) Xiaoguang Guo et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

A molecular dynamics investigation into the mechanisms of material removal and subsurface damage of nanoscale high speed laser-assisted machining

(2016) Houfu Dai et al.   MOLECULAR SIMULATION

Effect of crystal orientation on the formation of bct-5 silicon

(2015) Kausala Mylvaganam et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations

(2015) Jia Li et al.   APPLIED SURFACE SCIENCE

Mechanical research and development of a monocrystalline silicon neutron beam window for CSNS

(2015) Liang Zhou et al.   Chinese Physics C

Evaluation of repeated single-point diamond turning on the deformation behavior of monocrystalline silicon via molecular dynamic simulations

(2014) Lin Zhang et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding

(2014) Jia Li et al.   APPLIED SURFACE SCIENCE

Prediction of the threshold load of dislocation emission in silicon during nanoscratching

(2013) Q.H. Fang et al.   ACTA MATERIALIA

A numerical study of residual stress induced in machined silicon surfaces by molecular dynamics simulation

(2013) Yachao Wang et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

A study on phase transformation of monocrystalline silicon due to ultra-precision polishing by molecular dynamics simulation

(2012) Lin Zhang et al.   AIP Advances

Nanoscratch-induced phase transformation of monocrystalline Si

(2010) Y.Q. Wu et al.   SCRIPTA MATERIALIA

Phase transformation of single crystal silicon induced by grinding with ultrafine diamond grits

(2010) Zhenyu Zhang et al.   SCRIPTA MATERIALIA

Molecular dynamics simulation of subsurface deformed layers in AFM-based nanometric cutting process

(2008) J.J. Zhang et al.   APPLIED SURFACE SCIENCE